Roughening of the back surface of sapphire wafers for LEDs
Increased productivity with precision blasting processing on wafers! Simple operation by just setting the workpiece on the front.
The "Back Surface Roughening for LED Sapphire Wafers" is a device compatible with wafer sizes of 6 inches or less. It automatically processes the workpiece simply by setting it on the front of the main unit, and can precisely set the processing roughness to approximately Ra = 1μm, making it superior in roughness uniformity compared to lapping machines. The cutting amount can also be precisely controlled, processing a 6-inch wafer in under 70 seconds per piece. 【Features】 - Compatible with wafer sizes of 6 inches or less - Can precisely set processing roughness to approximately Ra = 1μm - Superior roughness uniformity compared to lapping machines - Cutting amount can also be precisely controlled - Processes a 6-inch wafer in under 70 seconds per piece *For more details, please feel free to contact us.
